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E-MRS Spring 2012 - Symposium M

More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

 

pdf Full Program Sympo M 605.96 Kb

The "More than Moore" concept explores a new area of Silicon based microelectronics, which goes beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, "More than Moore" promises for exciting new technological possibilities.

Scope

In the past decades, the main stream of microelectronics progresses is mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. Both strategies are calling for the heterogeneous integration of materials traditionally not present in silicon fabs. While microelectronics community continues to invent new solutions to keep Moore's law alive, there is increasing need for the development of "More than Moore" technologies which are based on merging silicon technologies with new concepts and materials, further then simply scaling with Moore's law.

Typical examples are RF, Power/HV, Passives, Optics, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration, including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials.

Important key challenges for the realization of the "More than Moore" strategy are:

  • perspective materials for future THz devices
  • materials systems for embedded sensors and actuators
  • perspective materials for monolithic heterogenous integration
  • material systems for embedded innovative memory technologies
  • development of new materials with customized characteristics
  • Through silicon via (TSV) approaches and 3D integration schemes

Hot topics to be covered by the symposium

Deposition and material science characterization:

  • CMOS scaling based on non-Si materials (III/V, oxides etc)
  • Epitaxial growth of Germanium and compound semiconductors on Silicon
  • Atomic Layer Deposition (ALD) of oxides and nitrides
  • Piezoelectric films and nanostructures
  • Characterization and metrology of very thin oxide layers

Functional materials integration on Silicon:

  • Development of functional ceramics thin films
  • Bio- and CMOS compatible material systems
  • Semiconducting oxides devices
  • New dielectric materials for advanced microelectronics

List of invited speakers

  • Max Lemme, KTH Royal Institute of Technology, Sweden
  • Paulo V. Santos, Paul-Drude-Institute, Berlin, Germany
  • Giovanni Capellini, University of Roma Tre, Italy
  • Lars Zimmermann, IHP, Germany
  • Catherine Dubourdieu, IBM T.J Watson Research Center, USA
  • Claudia Wiemer, Laboratorio MDM, IMM-CNR, Italy
  • Albert Chin, National Chia Tung University, Hsinchu, Taiwan
  • Fred Roozeboom, Eindhoven University of Technology, Netherlands
  • Chiara Marchiori, IBM Research GmbH, Switzerland 
  • Sylvain Maitrejean, CEA-LETI, France
  • Patrick Cogez, STMicroelectronics Crolles, France 

Scientific Committee :

  • Matthias Albert, Technical University of Technology, Germany
  • Karim Cherkaoui, Tyndall Institute, Ireland
  • Adulfas Abrutis, Vilnius University, Lithuania
  • Karol Fröhlich, Slovak Akedemy of Sciences, Slowenia
  • Patrice Gonon, LTM - MINATEC - CEA/LETI, France
  • Antoine Goullet, Institut des Matériaux Jean-ROUXEL (IMN), France

Sponsors:

ibm_logo  st 

Symposium Organizers

Christian Wenger
IHP – Leibniz
Institute for Innovative Microelectronics
Im Technologiepark 25
15236 Frankfurt / Oder, Germany
Phone: +49 / 335 5625 135
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Jean Fompeyrine
IBM Research GmbH
Zurich Research Laboratory
Säumerstrasse 4
CH-8803 Rüschlikon, Switzerland
Phone: +41-44-724-8387
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Christophe Vallée
LTM – Université Joseph Fourier
UMR CNRS 5130 CEA/LETI/MINATEC
38054 Grenoble Cedex 9, France
Phone: +33 4 38 78 17 23
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Jean-Pierre Locquet
Katholic University of Leuven
Afdeling Vaste-stoffysica en Magnetisme
Celestijnenlaan 200d
3001 Heverlee, Belgium
Phone: +32 16327290
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Sun 26/05: 13:30 - 19:00
Mon 27/05: 07:30 - 18:00
Tue 28/05: 08:00 - 18:00
Wed 29/05: 08:00 - 18:00
Thu 30/05: 08:00 - 18:00
Fri 31/05: 08:00 - 12:00 

Important deadlines

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     E-MRS FALL MEETING 13
    DEADLINE FOR ABSTRACT 
              SUBMISSION
             JUNE 10, 2013
 

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